HYBOND, Inc.
HYBOND, Inc. designs, manufactures, and sells; Thermosonic Ball and Wedge Wire Bonders, Peg Bonders (Single Point TAB Bonders), Epoxy and Silver-Glass Die Bonders, Eutectic and Laser Diode Die Bonders, Pulsed Heat Fluxless/Eutectic Die Attach Station, DFS Universal Bonder Test Units, and a variety of adjustable height heated work stages.
Language: English
FINEPLACER® pico 2 The Most Powerful Tool for Lab & Research Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework.We provide solutions for each stage of your journey - from R&D to industrial automated production. Research & Development Our R&D Bonders are ready to tackle the challenges of today and tomorrow. Flexible, accurate and retrofittable [..]
ZEVAC develops and produces machines for the component placement and the component interconnection technology